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Freescale Semiconductor and IBM announced that Freescale will join the IBM
technology alliance for joint semiconductor research and development.
The agreement includes Complementary Metal Oxide Semiconductor (CMOS) and
Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor
research and design enablement transitioning at the 45-nanometer generation.
Freescale is the first technology development partner in the IBM technology
alliance to participate in both low-power and high-performance technology
research and development.
This agreement brings together Freescale's leadership in key embedded
markets, including automotive, networking, wireless, industrial and
consumer, with IBM's success in developing world-class technology and
industry-leading systems expertise.
This alliance will enable Freescale to further strengthen its manufacturing
strategy. In addition to leveraging owned capacity in internal fabs and its
existing relationships with leading foundry manufacturers, Freescale will have
access to the combined manufacturing capacity of IBM's Common Platform
Partners.
“This partnership creates an exciting opportunity to combine the
complementary strengths of Freescale and the IBM Alliance,” said Sumit Sadana,
Senior VP-Strategy and Business Development and acting Chief Technology
Officer, Freescale. “This industry-leading technology roadmap will enable
Freescale to deliver substantial value to our customers.”
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