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TI's single-chip to enrich multimedia phones
 

 
DQC NEWS BUREAU
 
Sunday, January 21, 2007

 

During the 3G summit of wireless industry leaders held recently in Mumbai, Bobby Mitra, MD, Texas Instruments Incorporated India, touched upon the new OMAP-Vox single-chip solution designed to foster the development of low-cost multimedia-rich feature phones. Codenamed eCosto, the new single-chip platform is leveraging TI's innovative DRP technology, which is successful with the LoCosto value platform in volume production.
The eCosto platform also leverages the multimedia capabilities of the OMAP-Vox platform in volume production with the OMAPV1030 solution. The first product in the new eCosto platform will be the OMAPV1035 single-chip solution, which will be manufactured in 65 nanometer (nm) and will support GSM, GPRS and EDGE standards.

The eCosto platform repre­sents the latest advancement in TI's sophisticated and integrated DRP technology, a pioneering approach to wireless chip design that applies digital technology to simplify radio frequency (RF) processing in advanced CMOS process technology. Integrating the RF transceiver and analog codec with the digital baseband significantly reduces board space, extends battery life, and makes for a more powerful and versatile handset.

With the new OMAPV1035 single-chip solution, customers currently using TI's LoCosto platform and OMAP-Vox processors will be able to easily expand their handset portfolio with competitive, affordable multimedia-rich handsets.

As the current OMAPV1030 and new OMAPV1035 solutions share a common software platform, OMAP-Vox customers will be able to re-use their application and modem software investments for faster and more cost-effective multimedia-rich feature phone development. Earlier TI also announced work with leading application software providers like Sasken to further boost rapid integration of multimedia applications into handsets.

“As the emerging markets evolve beyond voice-centric, basic multimedia applications, we must support the integration of more advanced multimedia features into our single-chip cell phone solutions,” said Alain Mutricy, VP and GM-Cellular Systems Solutions (Wireless Terminals Business Unit), TI. “Now ramping into mass production with LoCosto solutions, we are taking our DRP single-chip technology to the next level with the eCosto platform, dramatically lowering system costs of advanced multimedia handsets.”

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