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Brief us about the new A-Data launches at Computex 2009.
We announced the launch of memory modules, CompactFlash (CF) cards, new
solid-state drive (SSD) products, hard disk drives, and huge-capacity as well as
nobility/theme/sport/classic (NTSC) series USB flash drives.
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Peter Liu
Senior Marketing Specialist-Sales Department, XPG |
| A-Data showcased several
products in Computex 2009, starting from the attractive Disney series of USB
drives to high performance tri-channel thermal conductive DRAMs |
At the event, XPG Overclocking series memory modules and solid-state drives (SSD)
were put on the spotlight. In addition to this, A-Data unveiled its solid-state
disks (SSD), including the Intel co-logo A-Data X25-M SSD, the ultra-high
performance XPG Series SX94 SSD with capacity up to 512GB, the SATA-II SSD S592
with performance up to 230/170MB per second in read/write speed.
We also presented the CompactFlash (CF) cards-CF600X and Disney series USB
flash drives.
What is A-Data's strategy for the future?
We are seeing a very good market for the memory products due to the boom in the
online gaming segment. There is an extensive market for computer-related
accessories. All our products are aimed at the global market and we have the
same amount of focus in each and every region, although we see a huge potential
in APAC, Europe and America.
Do you develop products based on customer feedback?
Gamers today are looking for stable products and we want to provide that
stability and high performance in the gaming segment. We have already started
providing some stable components to our gaming product DRAM, which we developed
based on the feedback received from gamers. The Indian gaming market is maturing
and therefore, we will try to develop more gaming-related products for the
market here.
Heat is a major problem for gamers. What is A-Data's take on this
particular challenge?
Heat is a major problem not only for the overclockers but also for any
end-user. Especially in the regions like India or Africa, where users are
exposed to heat naturally. A-Data has brought in a more comprehensive solution
for this problem. A-Data presented its XPG Plus Series v2.0 and Gaming Series
v2.0 DRAM module with superior thermal conductive technology and characteristics
heat sink design at Computex 2009.
Adopting new dual copper heat pipe design, the XPG Plus Series v2.0 DRAM
module offers offload heat with extreme efficiency to ensure superior stability
and performance. Each memory chip is direct contact with a thermo-conductive
copper heat pipe to turn the heat away from memory components, and dissipate it
through the aluminum fin array. The XPG Gaming Series v2.0 DRAM module adopts
additional surface area of heat sink to provide effective heat dissipation via
effective heat sink design. Moreover, both XPG Plus Series v2.0 and XPG Gaming
Series v2.0 DRAM module come with doubling amount of copper of PCB (printed
circuit board) to delivering low temperature and better power efficiency from
critical areas of the DRAM module. Page(s) 1
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